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  1. www.disco.com.sg › eg › solutionDicing Thin Wafers | Blade Dicing | Solutions | DISCO Corporation

    Through the proper blade, processing conditions, and the DISCO Short Kerf Check function, it is possible to dice thin wafers with extremely high processing quality. Please contact your DISCO representative for further details about thin wafer dicing and DISCO's premier applications support.

  2. www.disco.com.sg › eg › productsZ05 | Dicing Blades | Product Information | DISCO Corporation

    The Z05 Series electro-formed bond blades employ new DISCO advances in the materials and manufacturing process. By employing the new element technology, the Z05 series allows to select bond from two types.

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  4. www.disco.com.sg › eg › productsDAD3350 | Dicing Saws | Product Information | DISCO Corporation

    • Supports A Wide Range of Applications
    • Ease of Use
    • Process Quality

    DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades of up to Φ5 inches is possible with...

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    Operability is improved with installation of an LCD touch screen and Graphical User Interface (GUI). Easy operation is achieved with a visual display showing processing conditions and various statuses with icon buttons. In addition, operation commonalities were considered in order to achieve easy replacement from the 300/500 series (existing models...

    See full list on disco.com.sg

    By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved.

    See full list on disco.com.sg

  5. www.disco.co.jp › eg › productsProduct Information | DISCO Corporation

    Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. Precision Machines Dicing Saws

  6. www.discosin.com.sg › eg › productsDFD6340 | Dicing Saws | Product Information | DISCO Corporation

    The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws.

  7. technology.discousa.com › method › dicingDicing Process using Blades (Blade Dicing) | DISCO Technology...

    Dicing is a process for cutting and making grooves using dicing blades. Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is approx. 0.01 - 0.5 mm.

  8. disco.sg › eg › productsDAD3661 | Dicing Saws | Product Information | DISCO Corporation

    Support for workpiece sizes up to 360 × 360 mm. By selecting a user-specified dicing frame or jig table, the DAD3661 can support dicing for large packaging substrates including Fan-out WLP.