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Through the proper blade, processing conditions, and the DISCO Short Kerf Check function, it is possible to dice thin wafers with extremely high processing quality. Please contact your DISCO representative for further details about thin wafer dicing and DISCO's premier applications support.
The Z05 Series electro-formed bond blades employ new DISCO advances in the materials and manufacturing process. By employing the new element technology, the Z05 series allows to select bond from two types.
Introduction to DISCO solutions that help customers tackle issues concerning Kiru・Kezuru・Migaku processes, including technical know-how, test cuts, and processing services. Blade Dicing Laser Dicing
Supports a wide range of applications. DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard.
Single-axis dicing saw which is compatible with the 6 x 6-inch workpiece using a user-specified specification. Improved usability and performance Each model features an LCD touch panel with a graphical user interface for easy and intuitive operation.
Dicing is a process for cutting and making grooves on board-type workpieces approx. 10 mm thick using dicing blades. Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is approx. 0.01 - 0.5 mm.
The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafers.
DFD6363 offers improved usability through the adoption of a 19-inch monitor and highly visible GUI (Graphical User Interface). It also achieves reduced processing time by optimizing the axis operation through multiple-axis synchronous control.
The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws.
DISCO's dicing saws can offer higher singulation throughput and productivity as well as less copper burring, while DISCO's new resinoid blade for package singulation can significantly improve process quality.
