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Introduction to DISCO solutions that help customers tackle issues concerning Kiru・Kezuru・Migaku processes, including technical know-how, test cuts, and processing services. Blade Dicing Laser Dicing
- DISCO
Dicing and Grinding Service. It is effective in sample and...
- DISCO
Dicing and Grinding Service. It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.
Learn how DISCO provides high-quality dicing of thin wafers for IC cards, RFID tags, and SIPs. Find out about the blades, processing conditions, and short kerf check function for thin wafer dicing.
- Supports A Wide Range of Applications
- Ease of Use
- Process Quality
DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades of up to Φ5 inches is possible with...
Operability is improved with installation of an LCD touch screen and Graphical User Interface (GUI). Easy operation is achieved with a visual display showing processing conditions and various statuses with icon buttons. In addition, operation commonalities were considered in order to achieve easy replacement from the 300/500 series (existing models...
By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved.
The Z05 Series electro-formed bond blades employ new DISCO advances in the materials and manufacturing process. By employing the new element technology, the Z05 series allows to select bond from two types.
Dicing is a process for cutting and making grooves on board-type workpieces using dicing blades. Learn about the types of blades, dicing equipment, and materials processed with this method.
The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws.
