2016
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Aug 2, 2022 · Xiao is a scientist at Shanghai AI Laboratory, where he leads diverse R&D groups on AI for sports, healthcare, and robotics. Before that, he served as a Senior Researcher at the Visual Computing Group, Microsoft Research Asia (MSRA), from Feb. 2016 to Jul. 2022.
Articles 1–20. X.AI, Meta, IBM Yorktown Heights, Yale PhD' 13 - Cited by 2,800 - Machine Learning Hardware - Emerging Logic and Memory Device - Semiconductor Device and Materials.
Jun 30, 2021 · Xiao Sun. He designs imprecise—but energy-efficient—AI hardware and software. Artificial-intelligence systems often require a vast amount of computation.
View Xiao Sun’s profile on LinkedIn, a professional community of 1 billion members. National University of Singapore Student · Enthusiastic engineer with expertise in Safety and Environmental...
- HIMA Asia Pacific
Xiao Sun is part of a research group at IBM that has been finding ways to perform those computations using three-digit, or even just two-digit, numbers (in contrast, a modern laptop or cell phone uses 20 digits to make calculations, while most dedicated machine-learning chips use five).
View Xiao Sun’s profile on LinkedIn, a professional community of 1 billion members. AI Hardware/Accelerators<br>. AI HW/SW/Algorithm co-design<br>.
- xAI
2022. Articles 1–20. Curtin University - Cited by 519 - Focused Ion Beam (FIB) - ToF-SIMS - Porous Silicon - MEMS (microelectromechanical system) - Micro/Nano.
Xiao Sun (Member, IEEE) received the Ph.D. degree in electrical engineering from Université Grenoble Alpes, Grenoble, France, in 2001. She is currently a Principal Member of Technical Staff with IMEC, Leuven, Belgium.
Amphipathic binder integrating ultrathin and highly ion‐conductive sulfide membrane for cell‐level high‐energy‐density all‐solid‐state batteries. D Cao, Q Li, X Sun, Y Wang, X Zhao, E Cakmak, W...
Biography. Xiao Sun was born in 1980. He received the M.E. degree from the Department of Computer Sciences and Engineering, Dalian University of Technology, in 2004, and the double Doctor’s degree from the University of Tokushima, Tokushima, Japan, in 2009, the Dalian University of Technology of China, Dalian, China, in 2010.
