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Introduction to DISCO solutions that help customers tackle issues concerning Kiru・Kezuru・Migaku processes, including technical know-how, test cuts, and processing services. Blade Dicing Laser Dicing
Dicing and Grinding Service. It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.
Through the proper blade, processing conditions, and the DISCO Short Kerf Check function, it is possible to dice thin wafers with extremely high processing quality. Please contact your DISCO representative for further details about thin wafer dicing and DISCO's premier applications support.
Supports a wide range of applications. DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard.
The Z05 Series electro-formed bond blades employ new DISCO advances in the materials and manufacturing process. By employing the new element technology, the Z05 series allows to select bond from two types.
Dicing is a process for cutting and making grooves on board-type workpieces approx. 10 mm thick using dicing blades. Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is approx. 0.01 - 0.5 mm.
The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws.
